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Um novo adesivo dentário com ou sem 10-MDP? : caracterização química com FTIR-ATR
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Advisor(s)
Abstract(s)
Objetivos: Avaliar a composição química do adesivo OliEtch BOND (Olident, Podleze, Polónia), utilizando a técnica de espectroscopia de infravermelho transformada de Fourier com refletância total atenuada (FTIR-ATR), para confirmar a presença de 10-MDP.
Materiais e métodos: Foram utilizados dois sistemas adesivos: ScotchbondTM Universal Plus(3M ESPE, St.Paul, MN, EUA) (grupo controlo) e OliEtch BOND (Olident, Podleze, Polónia) (grupo experimental). A composição química foi avaliada através dos espectros obtidos porATR-FTIR em tempo real antes, durante e após a fotopolimerização (n = 3). A modelação dos componentes baseou-se em espectros de referência de solventes, monómeros metacrilatos e cargas inorgânicas. A análise gravimétrica quantificou o conteúdo de cargas (n = 3). A análise dos espectros resultantes foi realizada com recurso ao software Spectrum TimeBase v. 3.1.4. Os dados foram analisados estatisticamente com OriginPro 2024 (𝛼 = 0,05).
Resultados: A modelação por FTIR sugeriu que ambos os adesivos apresentam uma composição química semelhante, incluindo grupos químicos como Bis-GMA, TEGMA,
HEMA, 10-MDP, água e etanol. Relativamente à percentagem de partículas de carga (% em peso), o adesivo OliEtch BOND apresentou um valor inferior (7,65 %) do que o Scotchbond™ Universal Plus (9, 41 %) (t-test, p < 0,05).
Conclusões: A análise espectroscópica por FTIR-ATR permitiu identificar os principais componentes químicos do adesivo OliEtch BOND, confirmando a presença de 10-MDP, bem como de outros monómeros como HEMA, Bis-GMA e TEGMA. Os resultados demonstraram que a composição do OliEtch BOND é comparável à do adesivo de referência Scotchbond™ Universal Plus, embora com uma percentagem de partículas de carga inferior.
Objectives: To evaluate the chemical composition of the adhesive OliEtch BOND (Olident, Podleze, Poland) using Fourier-transform infrared spectroscopy with attenuated total reflectance (FTIR-ATR) to confirm the presence of 10-MDP. Materials and methods: Two adhesive systems were used: Scotchbond™ Universal Plus (3M ESPE, St. Paul, MN, USA) (control group) and OliEtch BOND (Olident, Podleze, Poland)(experimental group). The chemical composition was assessed through spectra obtained by real-time ATR-FTIR before, during, and after photo-polymerization (n = 3). Componentmodeling was based on reference spectra of solvents, methacrylate monomers, and inorganic fillers. Gravimetric analysis quantified the filler content (n = 3). Analysis of the resulting spectra was performed using Spectrum TimeBase v. 3.1.4 software. Data were statistically analyzed using OriginPro 2024 (𝛼 = 0.05). Results: FTIR modeling suggested that both adhesives have a similar chemical composition, including chemical groups such as Bis-GMA, TEGMA, HEMA, 10-MDP, water, and ethanol. Regarding the filler particle percentage (by weight), OliEtch BOND showed a lower value (7.65%) compared to Scotchbond™ Universal Plus (9.41%) (t-test, p < 0.05). Conclusions: FTIR-ATR spectroscopic analysis accurately identified the main chemical components of the OliEtch BOND adhesive, confirming the presence of 10-MDP, as well as other monomers such as HEMA, Bis-GMA, and TEGMA. The results demonstrated that the composition of OliEtch BOND is comparable to that of the reference adhesive Scotchbond™ Universal Plus, although with a lower filler particle content.
Objectives: To evaluate the chemical composition of the adhesive OliEtch BOND (Olident, Podleze, Poland) using Fourier-transform infrared spectroscopy with attenuated total reflectance (FTIR-ATR) to confirm the presence of 10-MDP. Materials and methods: Two adhesive systems were used: Scotchbond™ Universal Plus (3M ESPE, St. Paul, MN, USA) (control group) and OliEtch BOND (Olident, Podleze, Poland)(experimental group). The chemical composition was assessed through spectra obtained by real-time ATR-FTIR before, during, and after photo-polymerization (n = 3). Componentmodeling was based on reference spectra of solvents, methacrylate monomers, and inorganic fillers. Gravimetric analysis quantified the filler content (n = 3). Analysis of the resulting spectra was performed using Spectrum TimeBase v. 3.1.4 software. Data were statistically analyzed using OriginPro 2024 (𝛼 = 0.05). Results: FTIR modeling suggested that both adhesives have a similar chemical composition, including chemical groups such as Bis-GMA, TEGMA, HEMA, 10-MDP, water, and ethanol. Regarding the filler particle percentage (by weight), OliEtch BOND showed a lower value (7.65%) compared to Scotchbond™ Universal Plus (9.41%) (t-test, p < 0.05). Conclusions: FTIR-ATR spectroscopic analysis accurately identified the main chemical components of the OliEtch BOND adhesive, confirming the presence of 10-MDP, as well as other monomers such as HEMA, Bis-GMA, and TEGMA. The results demonstrated that the composition of OliEtch BOND is comparable to that of the reference adhesive Scotchbond™ Universal Plus, although with a lower filler particle content.
Description
Dissertação para obtenção do grau de Mestre no Instituto Universitário Egas Moniz
Keywords
Composição química Adesivos FTIR Monómeros